IC REG LIN POS ADJ 250MA 12DFN
| Part Number | LT3012BEDE |
| Date Code | 2230 |
| Quantity Available | 10776 pcs |
| Manufacturer | Linear Technology/Analog Devices |
| Lead Time | Ship within 24 hours |
| QTY | 2500 |
| Datasheet | LT3012B.pdf |
| Minimum Quantity | More than 50pcs |
| Distributor | SingSun |
| RoHS Status | Lead free / RoHS Compliant |
| Ship From | Hong Kong |
| Shipment Way | EMS/SF/DHL/TNT/UPS/FedEx |
| Country of Assembly | MALAYSIA |
| Country of Diffusion | USA |
| Lot Number | WG37137.88 |
| MSL | 1 |
| Packaging | - |
| Series | * |
| Base Product Number | LT3012B |
| Output Configuration | - |
| Output Type | - |
| Number of Regulators | - |
| Voltage - Input (Max) | - |
| Voltage - Output (Min/Fixed) | - |
| Voltage - Output (Max) | - |
| Voltage Dropout (Max) | - |
| Current - Output | - |
| Current - Quiescent (Iq) | - |
| Current - Supply (Max) | - |
| PSRR | - |
| Control Features | - |
| Protection Features | - |
| Operating Temperature | - |
| Mounting Type | - |
| Package / Case | - |
| Supplier Device Package | - |
The LT3012BEDE is a high voltage, micropower low dropout linear regulator. The device is capable of supplying 250mA of output current with a dropout voltage of 400mV. Designed for use in battery-powered or high voltage systems, the low quiescent current (40µA operating and 1µA in shutdown) makes the LT3012BEDE an ideal choice. Quiescent current is also well controlled in dropout.
Other features of the LT3012BEDE include the ability to operate with very small output capacitors. The regulator is stable with only 3.3µF on the output while most older devices require between 10µF and 100µF for stability. Small ceramic capacitors can be used without any need for series resistance (ESR) as is common with other regulators. Internal protection circuitry includes reverse-battery protection, current limiting, thermal limiting and reverse current protection.
The device is available with an adjustable output with a 1.24V reference voltage. The LT3012BEDE regulator is available in the 16-lead TSSOP and 12 pin low profile (0.75mm) (4mm × 3mm) DFN packages with an exposed pad for enhanced thermal handling capability.
