IC VREF SHUNT 1.235V TO-51-2
| Part Number | AD589SH/883B |
| Date Code | 2007 |
| Quantity Available | 19604 pcs |
| Manufacturer | Analog Devices Inc. |
| Lead Time | Ship within 24 hours |
| QTY | 1000 |
| Datasheet | AD589.pdf |
| Minimum Quantity | More than 50pcs |
| Distributor | SingSun |
| RoHS Status | Lead free / RoHS Compliant |
| Ship From | Hong Kong |
| Shipment Way | EMS/SF/DHL/TNT/UPS/FedEx |
| Country of Assembly | MALAYSIA |
| Country of Diffusion | KOREA |
| Lot Number | TC75569.68 |
| MSL | 1 |
| Packaging | - |
| Base Product Number | AD589 |
| Reference Type | Shunt |
| Output Type | Fixed |
| Voltage - Output (Min/Fixed) | 1.235V |
| Voltage - Output (Max) | - |
| Current - Output | - |
| Tolerance | - |
| Temperature Coefficient | 100ppm/°C |
| Noise - 0.1Hz to 10Hz | - |
| Noise - 10Hz to 10kHz | 5μVrms |
| Voltage - Input | - |
| Current - Supply | - |
| Current - Cathode | 50μA |
| Operating Temperature | -55°C ~ 125°C |
| Mounting Type | Surface Mount |
| Package / Case | 48-TQFP |
| Supplier Device Package | 48-TQFP (7x7) |
The AD589SH/883B is a two-terminal, low cost, temperature compensated bandgap voltage reference which provides a fixed 1.23 V output voltage for input currents between 50 µA and 5.0 mA.
The high stability of the AD589 is primarily dependent upon the matching and thermal tracking of the on-chip components. Analog Devices' precision bipolar processing and thin-film technology combine to provide excelent performance at low cost.
Additionally, the active circuit produces an output impedance ten times lower than typical low-TC Zener diodes. This feature allows operation with no external components required to maintain full accuracy under changing load conditions.
The AD589 is available in seven versions. The AD589J, K, L and M grades are specified for 0°C to +70°C operation, while the S, T, and U grades are rated for the full -55°C to +125°C temperature range. All grades are available in a metal can (H-02A) package. The AD589J is also available in an 8-pin SOIC package.
